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Shinil develops a thermally conductive composites (TCCs) to control heat during operation of IC devices.
By incorporation of thermally conductive fillers into engineering plastics, Shinil offers a wide range of thermal
conductivity, 1W/mK to 10W/mK and high dielectric withstand as well. These novel materials can be used for
LED package parts, automotive heat sink, mobile phone frame, battery packaging where heat diffusion is
critical for its efficiency and service life.